Do you know what the term 'machining accuracy' means?

What is "丝" and "谬"?

Answer/: In fact, the real big players are hidden in the chip workshop! The thinning equipment is the invisible king that makes the chip "slim like lightning." The wafer thinning machine, also known as the wafer grinding machine, is a device specifically used for fine processing of the surface of semiconductor wafers. It removes excess material from the wafer surface through grinding processes, optimizing wafer thickness and improving chip heat dissipation efficiency and electrical performance.

Actually, these units are commonly used length units in the machining industry to measure the precision of part processing, typically measured by micrometers or coordinate measuring machines. The conversion relationship is: 1丝 = 0.01 millimeters = 10谬, 1mm = 100丝 = 1000谬.

For example, the diameter of a hair is about 0.08mm, which is 80谬; industries like semiconductor manufacturing, aerospace, and healthcare all require very high precision. I wonder what precision the parts you're machining at work can achieve? Feel free to share and discuss in the comments.

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