Do you know how CMP equipment is polished and cleaned?
Do you know how CMP equipment polishes and cleans?
A/: This hard-working “perfectionist” in front of you is a core piece of equipment in semiconductor manufacturing—Chemical Mechanical Polishing equipment, or CMP equipment for short. It removes excess material from the wafer surface by combining chemical etching and mechanical grinding, achieving high-precision planarization and laying the foundation for subsequent processes such as lithography and etching.
The core of CMP equipment includes the polishing and cleaning sections. The polishing part consists of a polishing head and a grinding platen. The head holds the wafer and applies pressure, while the platen drives the polishing pad to rotate, ensuring a flat surface. The cleaning section uses brushes and a fluid supply system to remove particles and contaminants after polishing, ensuring wafer cleanliness.
During this process, many parts or components are exposed to corrosive media such as slurry, so bearings must meet strict requirements for corrosion resistance, wear resistance, and high-temperature durability. If a bearing fails, it can lead to increased vibration, reduced precision, or even wafer scratching, causing significant losses.
Therefore, choosing the right bearing is crucial. Ceramic bearings are ideal for CMP equipment due to their corrosion resistance, high rigidity, low thermal expansion, and non-magnetic properties. For example, Yun Bearings’ silicon nitride ceramic bearings perform excellently in high temperature, high speed, and chemical environments, significantly extending equipment life and reducing maintenance costs. If you’re facing similar operating conditions and are unsure about bearing selection, feel free to contact us!
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1、CMP行业
- CMP equipment/semiconductor equipment bearing usage environment and usage requirement
- Do you know how CMP equipment is polished and cleaned?